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HOME > Products > Burn In Board

This product is called DUT(Device Under Testing), which is adhered with many sockets to test a large volume of semiconductor devices. This board is used in high temperature, in order to check for defects, by attaching the device to the board in the chamber, where it maintains a constant temperature over 125¡É.


Specification
(Unit : mm)
(Unit : inch)
Layer
18-24
18-24
Base material
FR-4,
Polyimide,
High-Tg FR-4
BT-Resin
FR-4,
Polyimide,
High-Tg FR-4
BT-Resin
Thickness
1.6
0.062
Conductor width
0.06
0.0023
Conductor space
0.07
0.0027
Hole diameter
©ª 0.1
0.0039
Surface treatment
Gold finger & HASL
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* Semiconductor IC burn-in testing

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