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HOME > Products > Probe Card

Recent advance in high-speed technology have increased switching time of semiconductor. This PCB model is introduced to operate at faster frequencies. This leads PCB to avoid breakdown, circuit delays, and decreases energy loss. These factors lead to increase layer number.


Specification
(Unit : mm)
(Unit : inch)
Layer
10-70
10-70
Base material
FR-4,PPE
FR-4,PPE
Thickness
4.8-7.0
0.19 - 0.275
Conductor width
0.09
0.0035
Conductor space
0.10
0.0039
Hole diameter
©ª 0.3
0.010
Surface Treatment
Immersion
Gold
Electrolytic Hard Gold
0.03§­


1.27§­
1.2micro inch


50micro inch


* Semiconductor wafer probing &IC testing
* High-speed signal processing units
* High frequency communication equipment

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