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Back Plane Board
This board combines several layers of circuitry with plated through holes to form a much smaller and concentrated package. It also increases the speed of the electronic signals to assist high speed applications.
Specification
(Unit : mm)
(Unit : inch)
Layer
4-26
4-26
Base material
FR-4
FR-4
Thickness
3.2
0.126
Conductor width
0.10
0.0039
Conductor space
0.10
0.0039
Hole diameter
©ª 0.2
0.008
Surface treatment
Immersion Gold
Electrolytic Hard Gold
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* High-End Computers
* Communications Transformer (TRS)
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